Chuan Li
Professor

TEL: +886-(0)2 2826 7397

FAX: +886-(0)2 2821 0847
Email: cli10@ym.edu.tw

"For those of us who belives in physics,
this separation between past, present and future is only an illusion, however tenacious."
Albert Einstein

 

image005      Education

1991-1998 THE UNIVERSITY OF MICHIGAN, Ann Arbor, MI, USA

Ph.D. in Mechanical Engineering and Applied Mechanics.

MS. in Mechanical Engineering and Applied Mechanics.

1983-1987 NATIONAL CHENG KUNG UNIVERSITY, Tainan, Taiwan

成功大學字樣圖

BS. in Hydraulics and Ocean Engineering.

image005      Experience

Feb. 2014 – present NATIONAL YANG MING UNIVERSITY, TAIWAN

  • Department of Biomedical Engineering 

Professor

Course of Teaching: Kinematics and Mechanisms, Vibration, Advanced Mechanics of Materials, Finite Element Method, Engineering Statistics.

Aug. 2013 – Feb. 2014 NATIONAL CENTRAL UNIVERSITY, TAIWAN

  • Department of Mechanical Engineering 

Professor

Course of Teaching: Kinematics and Mechanisms, Vibration, Finite Element Method, Engineering Statistics.

Aug. 2009 – Jul. 2013 NATIONAL CENTRAL UNIVERSITY, TAIWAN

  • Department of Mechanical Engineering 

Associate Professor

Nov. 2000 – Aug. 2009 NANYANG TECHNOLOGICAL UNIVERSITY, SINGAPORE

  • School of Mechanical and Aerospace Engineering 

Oct 2005 – Aug 2009 Assistant Professor

Nov 2000 – Oct 2005 Associate Professor

Mar. 1999 – Sept. 2000 DAIMLERCHRYSLER CORPORATION, Detroit, MI, USA

  • Jeep/Truck Engineering - Powertrain CAE/Simulation 

CAE Project Engineer: FEM analysis for Manufacturing processes.

Feb. 1998 – Feb. 1999 FORD MOTOR COMPANY, Dearborn, MI, USA

  • Visteon -Alternative Power Systems

Project Engineer: Power Electronics Packaging Design.

1993 - 1997 THE UNIVERSITY OF MICHIGAN, Ann Arbor, MI, USA

  • Department of Mechanical Engineering
  • Department of Materials Science and Engineering

Teaching Assistant:

MSE250: Principles of Materials Science;

ME240: Introduction to Dynamics;

ME211: Introduction to Mechanics of Materials.

Research Assistant:

Stability analysis of thermal contact problems and residual stress analysis of casting process.

1989 - 1991 NATIONAL TAIWAN UNIVERSITY, Taipei, Taiwan

  • Research Assistant:

Optimization of Suitable Parameters of Demand Forecasting and Water Network Simulation Model in Taipei.

image005      Specialty and Research Interests

  • Cell mechanics and biomechanics of cellular deformation.
  • Stability analysis of PVD and reactive sputtering.
  • Metallic compounds and polymer thin films.
  • Thermal - mechanical coupled stability analysis.
  • Residual stress analysis for solidification.
  • Power electronics packaging design.

image005      Current Research Works

  • Stability Analysis of Reactive Sputtering.
  • Interactions of Red Blood Cells, Bio-mimetic Vesicle and Fluid.
  • Thermoelastic Contact Stability Analysis.
  • Mechanical Characterizations on Hydorgels.

Stability analysis of thermal-mechanical interactions:

·  “Three-dimensional analysis of the coupled thermo-piezoelectro-mechanical behaviour of multilayered plates using the differential quadrature technique,” K. M. Liew, Jordan Z. Zhang, C. Li, Intl. J. Solids Struct. 42, pp. 4239-4257, 2005.

·  “Thermoelastic stability of duplex heat exchanger tubes,” C. Li, J. R. Barber, International Journal of Mechanical Science, 40(6), pp. 575-588, 1998.

·  “Stability of thermoelastic contact of two layers of dissimilar materials,” C. Li, J. R. Barber, Journal of Thermal Stresses, 20, pp. 169-184, 1997.

 

Mechanics of cell, bio-capsule/vesicle and fluid interactions:

·   “Biomechanical study of the edge outgrowth phenomenon of encapsulated chondrocytic isogenous groups in the surface layer of hydrogel scaffolds for cartilage tissue engineering,” Soon Seng Ng, Kai Su, Chuan Li, Mary B. Chan-Park, Dong-An Wang, Vincent Chan, Acta Biomaterialia, 8(1), pp. 244-252, 2012.

·   “Experimental and numerical determination of cellular traction force on polymeric hydrogels,” Soon Seng Ng, Chuan Li, Vincent Chan, J. Roy. Soc. Interface Focus 1(5), pp.77-791, 2011.

·   “A miniature capacitive micromachined ultrasonic transducer array for minimally invasive photoacoustic imaging,” Cheng  X. Y., Chen J. K., Li C., IEEE/ASME J. Microelectromech. Sys. 19(4), pp.1002-1011, 2010.

·  “A miniature capacitive ultrasonic imager array,” Xiaoyang Cheng, Jingkuang Chen, Chuan Li, Jian-Hung Liu, I-Ming Shen, and Pai-Chi Li, IEEE Sensors, 9(5), pp. 569-577, 2009.

·   “Micromechanical characterization of hydrogel-based contact lens,” Li C., Ahearne M, Liu K. K., Int. J. Mod. Phys. B 24(1-2), pp.117-127, 2010.

·   “Nanomechanical characterization of red blood cells using optical tweezers,” Chuan Li, K. K. Liu, J. Mater. Sci.: Mater. Med. 9, pp. 1529–1535, 2008.

·   “Correlations between the experimental and numerical investigations on the mechanical properties of erythrocyte by laser stretching,” Chuan Li, Yong-Ping Liu, Kuo-Kang Liu, Alvin C. K. Lai, IEEE Transactions on NanoBioscience 7(1), pp. 80-90, 2008.

·   “The deformation of an erythrocyte under the radiation pressure by optical stretch,” Yong-Ping Liu, Chuan Li , Kuo-Kang Liu, Alvin C. K. Lai, J. Biomech. Eng., 128, pp. 830- 836, 2006.

·   “Experimental study on the deformation of erythrocytes under optically trapping and stretching,” Y. P. Liu, Chuan Li, A. C. K. Lai, Materials Science and Engineering: A, 423, pp. 128-133, 2006.

·   “A parameter study of the material properties in the vesicle-fluid interaction,” Chuan Li, Y. P. Liu, K. K. Liu, J. H. Hsieh, Computational Materials Science, 30(3), pp. 504-510, 2004.

 

Stability analysis of sputtering process and particle-surface interactions:

·  “Sputter-cleaning of an aluminum alloy using a thermionically assisted triode plasma system,” J. H. Hsieh, C. Li, S. J. Liu, 141(2–3), pp. 869–873, 2013.

·  “One-dimensional particle transmission in a statistically distributed potential field,” Chuan Li, J. H. Hsieh, Jui-Ching Cheng, Thin Solid Films, 516(16), pp. 5625-5631, 2008.

·  “Modeling and parameter analysis of plasma cleaning,” Chuan Li, J. H. Hsieh, Jui-Ching Cheng, Surf. Coat. Technol., 200, pp. 3370-3375, 2006.

·  “A study on the effect of two reactive gases in the reactive sputtering process,” Chuan Li, J. H. Hsieh, Jui-Ching Cheng, Thin Solid Films, 168-172, pp. 506-507, 2006.

·  “Stability analysis of reactive sputtering process with variable sticking coefficients,” Chuan Li, J. H. Hsieh, Thin Solid Films, 475(1-2), pp.102-108, 2005.

·  “A study on the reactive sputtering process with plasma chemistry,” Chuan Li, J. H. Hsieh, W. M. Huang, Surf. Coat. Technol., 198(1-3), pp.372-378, 2005.

·  “Effects of variable sticking coefficients on the stability of Reactive sputtering process,” C. Li, J. H. Hsieh, J. Phys. D:, 37 (7), pp. 1065-1073, 2004.

·  “Stability analysis of reactive sputtering process,” C. Li, J. H. Hsieh, Surf. Coat. Technol., 177-178, pp. 824-829, 2004.

·  “Calculation of sputtering rate by a monte carlo method,” J. H. Hsieh, C. Li, Journal of Material Science Letters, 22 (16), pp. 1125-1126, 2003.

·  “Parameters and stability analysis of reactive sputtering,” C. Li, J. H. Hsieh, Jpn. J. Appl. Phys., 42(10), pp. 6653-6657, 2003.

·  “Calculation of sputtering rate during a plasma-assisted process,” J. H. Hsieh, C. Li, Jpn. J. Appl. Phys., 42 (8), pp. 5295-5298, 2003.

 

Kinematics and mechanism:

·  “Management of parallel-manipulator singularities using joint-coupling,” Theingi, Chen, I.-M., Angeles, J., Li, C., Advanced Robotics, 21 (5-6), pp.583-600, 2007.

 

Physical vapor deposition and thin films:

·  “Effects of H2 and Ar Flow rates on the deposition of hydrogenated silicon thin films by an inductive coupled plasma-chemical vapor deposition system,” Chuan Li, J. H. Hsieh, K. L. Huang, Y. T. Shao, Y. Chen, Thin Solid Films, 544 pp. 37–43,2013.

·  “Deposition and characterization of a- and mc-Si:H thin films by ICP-CVD system with internal antennas,” J. H. Hsieh, H.C. Liang, Y. Setsuhara, C. Li, Surf. Coat. Technol., 231(25) pp. 550-556, 2013.

·  “Mechanical properties and antibacterial behaviors of TaN-(Ag,Cu) nanocomposite thin films after annealing,” J. H. Hsieh, T. H. Yeh, C. Li, S. Y. Chang, C. H. Chiu, C. T. Huang  Surf. Coat. Technol., 228(SI) pp. S116-S119, 2013.

·  “Electrical and structural study on indium zinc oxide thin films by sputtering process,” Chuan Li, J. H. Hsieh, S. J. Liu, W. S. Lin, Surf. Coat. Technol., 231(25) pp. 471-477, 2013.

·  “Sputtering process parameters to structural and electrical properties of indium zinc oxide thin films,” J. H. Hsieh, Chuan Li, S. J. Liu, W. S. Lin, Surf. Coat. Technol., 228(S1), pp. S499-S504, 2013.

·  “Mechanical and antibacterial behaviors of TaN-Cu nanocomposite thin films after multi-rejuvenation,” J. H. Hsieh, T. H. Yeh, S. Y. Chang, C. Li, C. C. Tseng, W. Wu, Surf. Coat. Technol., 228(S1), pp. S81-S85, 2013.

·  “Antibacterial and tribological properties of TaN–Cu, TaN–Ag, and TaN–(Ag,Cu) nanocomposite thin films,” J. H. Hsieh, T. H. Yeh, S. Y. Hung, S. Y. Chang, W. Wu, C. Li, Mater. Res. Bull., 47(10), pp. 2999-3003, 2012.

·  “Antibacterial properties of TaN-(Ag,Cu) nanocomposite thin films,” J. H. Hsieh, T. H. Yeh, C. Li, C.H. Chiu, C.T. Huang, Vacuum, 87, pp. 160-163, 2012.

·   “Optical studies on sputter-deposited Ag–SiO2 nanoparticle composites,” J. H. Hsieh, Chuan Li, Y. Y. Wu, S.C. Jang, Thin Solid Films, 519(20), pp.7124-7128, 2011.

·  “Optoelectronic properties of sputter-deposited Ag–SiO2 nanoparticle films by rapid thermal annealing,” J.H. Hsieh, Chuan Li, Y.Y. Wu, S.C. Jang, Curr. Appl. Phys. 11(1S) pp. S328-S332, 2011.

·  “Structures and photocatalytic behavior of tantalum-oxynitride thin films,” J.H. Hsieh, Chuan Li, H.C. Liang, Thin Solid Films, 519(15), pp.4699-4074, 2011.

·  “Effects of Ag contents on antibacterial behaviors of TaON–Ag nanocomposite thin films,” J.H. Hsieh, C.C. Chang, C. Li, S.J. Liu c, Y.K. Chang, Surf. Coat. Technol., 205 pp. S337-S340, 2010.

·  “Dissolution of Cu nanoparticles and antibacterial behaviors of tan-cu nanocomposite thin films,” Liu, P.C., Hsieh, J.H.; Li, C.; Chang, Y.K.; Yang, C.C., Thin Solid Films, 517(17), pp.4956-4960, 2009.

·  “Parametric and numerical study on the diffusion in a metalized amorphous binary alloys film,” Chuan Li, J.H. Hsieh, Z.Z. Tang, Jui Ching Cheng, Thin Solid Films, 517(17), pp.5087-5091, 2009.

·  “A diffusion study in the barrier of metallized amorphous binary alloys with numerical approach,” Chuan Li, J.H. Hsieh, Z. Z. Tang, Jui-Ching Cheng, Thin Solid Films, 517(14), pp. 3831-3836, 2009.

·  “Study on the amorphous Ta–Zr films as diffusion barrier in Cu metallization,” Chuan Li, J. H. Hsieh, Z. Z. Tang, J. Vac. Sci. Technol. A 26(4) pp.980-984, 2008.

·  “Diffusion barriers performance of amorphous Ta–Zr films in Cu metallization,” Chuan Li, J. H. Hsieh, Z. Z. Tang, Surf. Coat. Technol., 202 (22-23) pp.5672 -5679, 2008

·  “Mechanical properties of TaN-Cu nanocomposite yhin films,” Hsieh, J. H. Hsieh; P. C. Liu, C. Li, Surf. Coat. Technol., 202 (22-23) pp.5530-5534, 2008

·  “Effects of annealing on antiwear and antibacteria behaviors of TaN–Cu nanocomposite thin films,” J. H. Hsieh, M. K. Cheng, Y. K. Chang, C. Li, C. L. Chang, P. C. Liu, J. Vac. Sci. Technol. A 26(4) pp.1093-1097, 2008.

·  “Study of Cu emergence on the surface of TaN-Cu nanocomposite thin films and its effects on tribological property,” J.H. Hsieh, M.K. Cheng, C. Li, S.H. Chen, Y.G. Chang, Thin Solid Films, 516(16), pp. 5430-5434, 2008.

·  “Deposition and characterization of TaN–Cu nanocomposite thin films,” J. H. Hsieh, C. M. Wang, C. Li, Surf. Coat. Technol., 200 (10) pp.3179-3183, 2006.

·  “Effects of hollow cathode and Ar/H2 ratio on plasma cleaning of Cu leadframe,” J. H. Hsieh, C. Li, Thin Solid Films, 504 (1-2) pp. 101-103, 2006.

·  “Near-amorphous alloy thin films by co-sputtering deposition,” J. H. Hsieh, C. Li, C. M. Wang, Y. C. Liu, J. Metastable & Nanocrystalline Materials, 23, pp. 213-214, 2005.

·  “Effects of annealing on the microstructure and electrical properties of TaN-Cu nanocomposite thin films,” C. M. Wang, J. H. Hsieh, C. Li, Y. Fu, T.P. Chen, Surf. Coat. Technol., 193(1-3), pp. 173-177, 2005.

·  “Boundary-Free multi-element barrier films by reactive co-sputtering,” J. H. Hsieh, C. Li, C. M. Wang, Z. Z. Tang, Surf. Coat. Technol., 198 (1-3) pp.335-339, 2005.

·  “Phase transition and microstructure change in Ta-Zr alloy films by co-sputtering,” Z. Z. Tang,; J. H. Hsieh, S. Y. Zhang, C. Li, Y. Q. Fu, , Surf. Coat. Technol., 198(3), pp. 110-113, 2005.

·  “Electrical properties of TaN-Cu nanocomposite thin films,” C. M. Wang, J. H. Hsieh, Y. Q. Fu, C. Li, Ceramics Int’l, 30(7), pp. 1879-1883, 2004.

·  “Electrical and piezoresistive properties of TaN-Cu nanocomposite thin films,” C. M. Wang, J. H. Hsieh, C. Li, Thin Solid Films, 469-470, pp. 455-459, 2004.

·  “Study of oxidation and wear behaviors of (Nb,Cr)N thin films using raman spectroscopy,” J. H. Hsieh,; C. Li, A. L. K. Tan, C. Poh; N. J. Tan, Surf. Coat. Technol., 177, pp. 299-305, 2004.

·  “Effects of energetic particle bombardment on residual stress, microstrain and grain size of plasm-assisted PVD Cr thin films,” J. H. Hsieh, C. Li, R. F. Hochman, Thin Solid Films, 424, pp. 103-106, 2003.

·  “Deposition and characterization of Ti(C,N,O) coatings by unbalanced magnetron sputtering,” J. H. Hsieh ,W. Wu, C. Li, C. H. Yu, and B. H. Tan, Surf. Coat. Technol., 163-164, pp. 233-237, 2003.

·  “Synthesis of Ti(C, N, O) coatings by unbalanced magnetron sputtering,” J. H. Hsieh, C. Li, W. Wu, A.L.K. Tan, J. Mater. Proc. Technol. 140, pp. 662-667, 2003.

·  “Characterization of (TixCr0.6-x)N0.4 coatings and their tribological behaviors sliding against epoxy molding compound,” J. H. Hsieh, W. H. Zhang, C. Li, C. Q. Sun, Surf. Coat. Technol., 146-147, pp. 331-337, 2001.

 

Numerical studies on thermal mechanical properties of composites:

·  “Significant plasticity enhancement of ZrCu-based bulk metallic glass composite dispersed by in-situ and ex-situ Ta particles,” J. B. Li, J. S. C. Jang, C. Li, S. R. Jian, P. H. Tsai, J. D. Hwang, J. C. Huang, T.G. Nieh Mater. Sci. Eng. A, 551, pp.249-254, 2012.

·  “Numerical and experimental studies on the shear band intervention in zirconium based bulk metallic glass composites Zr53Cu22Ni9Al8Ta8,” Chuan Li, J. S. C. Jang, J. B. Li, D. J. Pan, S. R. Jian, J. C. Huang, T. G. Nieh, Intermetallics, 30, pp.111-116, 2012.

·  “Effective elastic property estimation for bi-continuous heterogeneous solids,” L. M. Xu, H. Fan, X. M. Xie, C. Li, CMC-Comput. Matre. Contua., vol.145, no.1, pp.1-9, 2009.

·  “Elastic property prediction by finite element analysis with random distribution of materials for tungsten/silver composite,” L. M. Xu, C. Li, H. Fan, B. Wang, J. Mater. Sci. vol. 43, pp.5804–5808, 2008.

 

Electron and proton conductive solid oxide:

·  “Experimental assessments on the resistance to oxidation and Cr evaporation of several Fe-Cr based alloys,” Jian-Jia Huang, Chuan Li, Shyong Lee, Ying-Sheng Li, Intermetallics 43, pp. 162–170 2013.

 

Shape memory materials:

·  “Effects of moisture on the thermomechanical properties of a polyurethane shape memory polymer,” B. Yang, WM. Huang, C. Li, L. Li, Polymer, 47(4) pp. 1348-1356, 2006.

·  “Qualitative separation of the effects of carbon nano-powder and moisture on the glass transition temperature of polyurethane shape memory polymer,” B. Yang, W.M. Huang, C. Li, L. Li, J.H. Chor, Scripta Materialia, 53 pp. 105–107, 2005.

·  “Effects of reheat treatment conditions on two-way shape memory,” W. M. Huang, H. B. Goh, C. Li, Journal of Material Science Letters, 21, pp. 991-993, 2002.

·  “On the effects of moisture in a polyurethane shape memory polymer,” B. Yang, W. M. Huang, C. Li, C. M. Lee, L. Li, Smart Mater. Struct., 13, pp. 191-195, 2004.

·  “Effects of moisture on the glass transition temperature of polyurethane shape memory polymer filled with nano carbon powder,” B. Yang, W. M. Huang, Chuan Li, J. H. Chor, European Polymer Journal, 41/5, pp 1123-1128, 2005.

·  “Water-driven programmable polyurethane shape memory polymer: demonstration and mechanism,” Huang, W. M., Yang, B., An, L., C. Li, Chan, Y. S. Applied Physics Letters, 86, pp.114105, 2005.